Thermal Adhesive Tape Li2000 Double Side Gap Filler (Silicone, Laptop/Gpu/Cpu.Specification: Thermal Conductivity: 1.3 W/mK Thickness: 0.25 mm Dielectric Breakdown Voltage(Vac): 3.1 KV/mm Dielectric Breakdown Voltage(Vdc): 4.1 KV/mm Density: 1.6 g/cm³ Working Temperature: -45~170°C Reinforcement Carrier: Fiberglass mesh Holding Power 1000g@25°CCusing 1 in2: >40000 Holding Power 1000g@80°CCusing 1 in2: >40000 (T-global guarantees a 6-month shelf life at maximum continuous storage temperature of 25 ?J for maintenance of controlled adhesion to the liner.) *Protective film may be different colors according to the model, it does not affect the function of the product. Application: Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc. Operating Manual: 1.When using thermal conductive double-sided tape, keep the adhesive surface clean and dry. 2.After tearing off the protector of the thermal tape, pressed it evenly (just a little strength) with your fingers to make sure the tape has greater contact with the surface. 3.The viscosity of the thermal tape have initial viscosity (40% of its maximum viscosity) and persistent viscosity. At room temperature, it takes 72 hours to achieve the maximum adhesive strength. 4.In the application process, appropriate heating (60 ~ 70 ?J) will greatly contribute to the effective of adhesive, and as soon as possible to achieve maximum adhesion. In the lower temperature of the winter, appropriate heating is a tip to increase the viscosity of the thermal tape. Storage: Store in a cool, dry place away from direct sunlight. Product Features
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