Double sided copper clad, for making PCB's.

• Thickness of top copper layer: 0.035mm
• Type of top layer copper: electrodeposited ED
• Substrate: FR4, TG130, UL94VO
• Thickness of substrate: 62thou FR4 (1.575mm)
• Thickness of bottom copper layer: 0.035mm
• Type of bottom layer: copper electrodeposited ED
• Total thickness: 1.645mm (1oz copper + 62thou FR4 + 1oz copper = 0.035+1.575+0.035)